The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jun. 08, 2017
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Kenji Ochi, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01R 13/03 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); H01R 12/585 (2013.01);
Abstract

An electrical component includes a connection portion that is to be in contact with other electrical component and is to establish an electrical connection with the other electrical component. The connection portion includes a plating film that defines a surface of the connection portion. The plating film includes a metal as a main constituent and an aromatic compound that is dispersed in the plating film. The aromatic compound has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2'-bipyridyl in spectrochemical series. A content of the aromatic compound in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.


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