The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 27, 2014
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yamaguchi, Tokyo, JP;

Hajime Nakayama, Tokyo, JP;

Haruo Ogino, Tokyo, JP;

Seiichi Kurihara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/08 (2006.01); H01P 3/08 (2006.01); H01P 3/06 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/085 (2013.01); H01P 3/06 (2013.01); H01P 3/08 (2013.01); H01P 11/005 (2013.01); H05K 1/0237 (2013.01); H05K 3/429 (2013.01); H05K 3/4652 (2013.01); H01P 11/003 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10356 (2013.01); Y10T 29/49167 (2015.01);
Abstract

A multilayer wiring plate includes a coaxial wire includes a signal line, an insulation coating and an outer peripheral conductor. An insulating layer is arranged on an inner or outer layer side. A metal film circuit is arranged by the intermediary of the insulating layer, and the metal film circuit and the outer peripheral conductor and signal line of the coaxial wire are connected. A signal line connection part that connects the signal line to the metal film circuit includes a penetration hole A that passes through the insulating layer and the outer peripheral conductor; the coaxial wire from which the outer peripheral conductor is removed inside the penetration hole A; a hole filling resin filled inside the penetration hole A; a penetration hole B that passes through the hole filling resin and the signal line; and a plated layer arranged on an inner wall of the penetration hole B.


Find Patent Forward Citations

Loading…