The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Mar. 03, 2016
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:
Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); F21V 19/00 (2006.01); H01L 25/075 (2006.01); F21K 9/232 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); F21K 9/232 (2016.08); F21V 19/0015 (2013.01); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.


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