The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Oct. 29, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Kiyohisa Tanaka, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H04N 3/14 (2006.01); H04N 1/028 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14607 (2013.01); H01L 27/14625 (2013.01); H01L 27/14687 (2013.01); H04N 1/028 (2013.01); H04N 3/155 (2013.01);
Abstract

The present technology relates to a semiconductor device and a method of manufacturing the same, a semiconductor module, and an electronic device capable of more certainly improving an optical characteristic and chromatic aberration. A semiconductor package provided with a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side, and a linear image sensor on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction, the linear image sensor fixed on the curved surface on which a light-receiving area formed of a plurality of pixels is curved so as to be concave to the light incident side is provided. The present technology may be applied to the semiconductor package used in an image reading device, for example.


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