The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 04, 2017
Applicant:

Infinera Corporation, Sunnyvale, CA (US);

Inventors:

Peter W. Evans, Tracy, CA (US);

John W. Osenbach, Kutztown, PA (US);

Fred A. Kish, Palo Alto, CA (US);

Jiaming Zhang, Macungie, PA (US);

Miguel Iglesias Olmedo, Sunnyvale, CA (US);

Maria Anagnosti, Mountain View, CA (US);

Assignee:

Infinera Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 31/02 (2006.01); H01L 23/538 (2006.01); G02F 1/225 (2006.01); G02B 6/12 (2006.01); G02F 1/21 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G02B 6/12004 (2013.01); G02F 1/2255 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 24/09 (2013.01); H01L 31/02005 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12147 (2013.01); G02F 2001/212 (2013.01); G02F 2201/127 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15323 (2013.01);
Abstract

Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.


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