The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Oct. 23, 2012
Applicant:

U.s. Army Research Laboratory Attn: Rdrl-loc-i, Adelphi, MD (US);

Inventors:

Patrick J Taylor, Vienna, VA (US);

Sudhir Trivedi, Nottingham, MD (US);

Wendy L Sarney, Columbia, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/03828 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83022 (2013.01); H01L 2224/83024 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/351 (2013.01); Y10T 403/478 (2015.01);
Abstract

Provided among other things is an electrical device comprising: a first component that is a semiconductor or an electrical conductor; a second component that is an electrical conductor; and a strong, heat stable junction there between including an intermetallic bond formed of: substantially (a) indium (In), tin (Sn) or a mixture thereof, and (b) substantially nickel (Ni). The junction can have an electrical contact resistance that is small compared to the resistance of the electrical device.


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