The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Oct. 02, 2017
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventor:
Kenji Konomi, Nagoya, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2017.01); H01L 23/00 (2006.01); H01L 21/784 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/784 (2013.01); H01L 23/585 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/37001 (2013.01);
Abstract
According to one embodiment, there is provided a manufacturing method of a semiconductor device. The method includes forming a first guard ring around a first chip region on a semiconductor wafer. The method includes forming a second guard ring around a second chip region on the semiconductor wafer. The method includes mechanically connecting the first guard ring with the second guard ring through a joist structure.