The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jun. 14, 2017
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventor:

Takashi Nonogawa, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/29 (2006.01); H01L 23/28 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 33/56 (2013.01); H01L 2924/18301 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method of manufacturing a light-emitting device that includes a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member. The method includes forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board, and dispensing a underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element.


Find Patent Forward Citations

Loading…