The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 14, 2016
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Toru Onoue, Tokyo, JP;

Ken Morita, Tokyo, JP;

Kenta Yamashita, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/236 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/236 (2013.01); H01G 4/30 (2013.01);
Abstract

A length in a first direction of the element body is smaller than a length in a second direction of the element body and smaller than a length in a third direction of the element body, the second direction being perpendicular to the first direction, the third direction being perpendicular to the first and second direction. Each of a first terminal electrode and a second terminal electrode includes a sintered conductor layer formed on the element body, a first plated layer formed on the sintered conductor layer, and a second plated layer formed on the first plated layer. In each of a first electrode portion disposed on a principal face and a third electrode portion disposed on a principal face, a maximum thickness of the sintered conductor layer is larger than a thickness of the first plated layer and not more than a thickness of the second plated layer.


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