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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10026523 B1

PDFFull Text
Date of Patent:
Jul. 17, 2018

Filed:

Apr. 14, 2015

Conductor and method of manufacturing the same

Applicant:

Alps Electric Co., Ltd., Tokyo, JP;

Inventors:

Yui Abe, Miyagi-ken, JP;

Yoshihiro Taguchi, Miyagi-ken, JP;

Mitsuo Bito, Miyagi-ken, JP;

Yoshiyuki Asabe, Miyagi-ken, JP;

Yasuyuki Kitamura, Miyagi-ken, JP;

Tomoyuki Yamai, Miyagi-ken, JP;

Koji Oguma, Miyagi-ken, JP;

Tomofumi Oba, Miyagi-ken, JP;

Assignee:

Alps Electric Co., Ltd., Tokyo, JP;

Attorney:

Beyer Law Group LLP

Primary Examiner:

Elizabeth A Robinson

Int. Cl.
CPC ...
H01B 5/14 (2006.01); B82Y 30/00 (2011.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); H01B 1/02 (2006.01); H01L 51/00 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); C23C 14/34 (2006.01); B82Y 40/00 (2011.01); H01L 51/10 (2006.01); H01L 51/52 (2006.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); B82Y 30/00 (2013.01); C23C 14/34 (2013.01); H01B 1/02 (2013.01); H01L 31/0224 (2013.01); H01L 31/022466 (2013.01); H01L 31/1884 (2013.01); H01L 51/0021 (2013.01); H05K 1/09 (2013.01); H05K 3/388 (2013.01); B82Y 40/00 (2013.01); H01L 51/102 (2013.01); H01L 51/442 (2013.01); H01L 51/5206 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10128 (2013.01); Y02E 10/50 (2013.01); Y10T 428/31663 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A conductor includes: a transparent conductive film which is formed on a transparent substrate and includes a silver nanowire; and a metal film of which at least a portion is formed to overlap the transparent conductive film, in which a portion in which the transparent conductive film and the metal film overlap each other includes a buffer film which has adhesion to each of the transparent conductive film and the metal film and does not impede conduction between the transparent conductive film and the metal film. Preferably, the buffer film is, for example, an ITO film, and at this time, an upper surface of the transparent conductive film is a reverse-sputtered surface.

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