The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Mar. 24, 2015
Applicants:

SK Hynix Inc., Gyeonggi-do, KR;

Reserch & Business Foundation Sungkyunkwan University, Gyeonggi-do, KR;

Inventors:

Tae Hee Han, Seoul, KR;

Jun Sun Hwang, Seoul, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); H01L 23/34 (2006.01); G06F 15/78 (2006.01); H01L 25/065 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0613 (2013.01); G06F 3/067 (2013.01); G06F 3/0625 (2013.01); G06F 3/0635 (2013.01); G06F 15/7825 (2013.01); H01L 23/34 (2013.01); H01L 25/0657 (2013.01); H01L 27/0248 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/0002 (2013.01); Y02D 10/12 (2018.01); Y02D 10/13 (2018.01);
Abstract

A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias), a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.


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