The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

May. 26, 2015
Applicant:

E Ink Holdings Inc., Hsinchu, TW;

Inventors:

Huai-Tze Yang, Hsinchu, TW;

Wei-Juin Chen, Hsinchu, TW;

Chien-Chung Huang, Hsinchu, TW;

Assignee:

E Ink Holdings Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G09G 3/34 (2006.01); G02F 1/167 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
G02F 1/167 (2013.01); H05K 1/092 (2013.01); H05K 3/4069 (2013.01); H05K 3/4664 (2013.01); G02F 2001/1676 (2013.01); H05K 1/0393 (2013.01); H05K 3/12 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/09854 (2013.01);
Abstract

The present disclosure provides a bottom electrode substrate for a segment-type electrophoretic display. The bottom electrode substrate includes a flexible substrate, a first conductive layer, an insulating layer, a second conductive layer and a segment-type electrode. The first conductive layer is disposed on the flexible substrate. The insulating layer covers the first conductive layer and the flexible substrate, wherein the insulating layer has at least one opening exposing a part of the first conductive layer. The second conductive layer is filled in the opening and in contact with the exposed first conductive layer. The segment-type electrode covers the second conductive layer and the insulating layer, and is in contact with the second conductive layer. A method for manufacturing the bottom electrode substrate is also provided herein.


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