The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 11, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

David Terry Trayhan, Jr., Greenville, SC (US);

Hua Zhang, Greer, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/22 (2006.01); G01H 1/00 (2006.01); G01M 13/02 (2006.01); G01N 29/11 (2006.01); G01N 29/12 (2006.01); G01N 29/14 (2006.01); G01N 29/24 (2006.01); G01N 29/44 (2006.01); G01N 29/46 (2006.01); G01N 29/48 (2006.01); H04R 1/02 (2006.01); H05B 33/08 (2006.01); H05B 37/02 (2006.01);
U.S. Cl.
CPC ...
G01N 29/22 (2013.01); G01H 1/006 (2013.01); G01M 13/028 (2013.01); G01N 29/11 (2013.01); G01N 29/12 (2013.01); G01N 29/14 (2013.01); G01N 29/223 (2013.01); G01N 29/2475 (2013.01); G01N 29/4454 (2013.01); G01N 29/46 (2013.01); G01N 29/48 (2013.01); H04R 1/028 (2013.01); H05B 33/0803 (2013.01); H05B 37/0227 (2013.01); G01N 2291/2693 (2013.01);
Abstract

Aspects of the disclosure include systems, methods, and program products for evaluating the condition of a component using an acoustic sensor embedded within a lighting device. A system according to the present disclosure can include a first lighting device configured to illuminate an area of an industrial plant; a first acoustic sensor embedded within the first lighting device and configured to detect an acoustic signature of a component in the industrial plant; a computing device communicatively connected to the first acoustic sensor and configured to evaluate a condition of the component in the industrial plant based on the acoustic signature.


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