The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Nov. 19, 2013
Applicants:

Aarhus Universitet, Aarhus C, DK;

Grundfos Holding A/s, Bjerringbro, DK;

Sp Group A/s, Søndersø, DK;

Inventors:

Mogens Hinge, Terndrup, DK;

Kim Daasbjerg, Skanderborg, DK;

Steen Uttrup Pedersen, Lystrup, DK;

Joseph Iruthayaraj, Aarhus C, DK;

Kristoffer Malmos, Hadsten, DK;

Allan Hjarbæk Holm, Langå, DK;

Jens Hinke, Roskilde, DK;

Susie-Ann Spiegelhauer, Smørum, DK;

Assignees:

Aarhus Universitet, Aarhus, DK;

Grundfos Holding A/S, Bjerringbro, DK;

SP Group A/S, Søndersø, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F04D 13/06 (2006.01); B29C 65/48 (2006.01); C08J 5/06 (2006.01); B29C 45/14 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); C08J 5/12 (2006.01); B29C 65/16 (2006.01); B29C 65/44 (2006.01); B29C 65/52 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
F04D 13/0626 (2013.01); B29C 45/14311 (2013.01); B29C 45/14778 (2013.01); B29C 65/02 (2013.01); B29C 65/48 (2013.01); B29C 65/483 (2013.01); B29C 65/4815 (2013.01); B29C 65/4895 (2013.01); B29C 65/523 (2013.01); B29C 65/8215 (2013.01); B29C 66/026 (2013.01); B29C 66/0344 (2013.01); B29C 66/1122 (2013.01); B29C 66/341 (2013.01); B29C 66/45 (2013.01); B29C 66/5344 (2013.01); B29C 66/74 (2013.01); B29C 66/91411 (2013.01); B29C 66/91443 (2013.01); B29C 66/91951 (2013.01); C08J 5/06 (2013.01); C08J 5/121 (2013.01); C08J 5/122 (2013.01); B29C 65/006 (2013.01); B29C 65/16 (2013.01); B29C 65/1635 (2013.01); B29C 65/1674 (2013.01); B29C 65/44 (2013.01); B29C 65/526 (2013.01); B29C 66/43 (2013.01); B29C 66/71 (2013.01); B29C 66/7422 (2013.01); B29C 66/7444 (2013.01); B29C 66/7461 (2013.01); B29C 66/7465 (2013.01); B29C 66/74281 (2013.01); B29C 66/74283 (2013.01); B29C 66/74285 (2013.01); B29C 66/8322 (2013.01); B29L 2031/7496 (2013.01);
Abstract

The present invention relates to alternative methods of joining a solid part () and a polymer (). The methods comprise attaching a primer layer () with a predetermined surface chemistry, density and thickness covalently to at least a part of a surface () of the solid part (). Some embodiments of the invention further comprise polymerizing second molecules onto the primer layer () so that the surface () is at least partly covered with surface immobilized polymer brushes (). The surface () of the solid part () is brought into contact with the polymer () and a predetermined temperature profile is applied resulting in covalent bonds () being established between the polymer () and the primer (), and/or polymer brushes () melting or softening and entangling with melted or softened polymer () so that the solid part () and the polymer () remain joined after cooling. The obtained strength of the bonding between the solid part () and the polymer () is significantly higher than if the same materials are joined with conventional methods not comprising the establishment of a primer layer ().


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