Installation for depositing films onto a substrate

Abstract

An installation, comprising a chamber comprising two ends, a transport unit and a support unit which introduce a two-sided substrate into the chamber, a stabilized high-voltage high-frequency power supply of at least 200 kW, comprising an HF transformer comprising a primary and a secondary circuit connected to terminals, at least two electrodes being connected to the terminals of the secondary circuit, said electrodes being placed on each side of the substrate, at least one dielectric barrier placed between the at least two electrodes; a power supply regulation/control unit placed upstream of the HF transformer that is capable of increasing an active power/reactive power ratio, an introducing unit for introducing at least one reactive substance into the chamber, and an extracting unit for extracting residual substances, wherein an adjustable inductor is placed in the secondary circuit of the transformer in parallel with a circuit comprising the at least two electrodes, and the adjustable inductor enables a phase shift between a voltage generated between the electrodes and a total current delivered by the high-voltage source to be modulated, and the power supply regulation/control unit, placed on the primary circuit of the transformer, and/or a unit for controlling the inductor being capable of generating harmonics extending a time during which a current flows between the electrodes, wherein the installation is suitable for depositing a film onto an inorganic substrate.