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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10023953 B1

PDFFull Text
Date of Patent:
Jul. 17, 2018

Filed:

Apr. 08, 2015

High purity refractory metal powders and their use in sputtering targets which may have random texture

Applicant:

H.c. Starck Inc., Newton, MA (US);

Inventors:

Patrick Hogan, Somerville, MA (US);

Paul Aimone, Bridgewater, MA (US);

Joseph Flanigan, Hudson, MA (US);

Marcel Hagymasi, Goslar, DE;

Helmut Haas, Boerssum OT Seinstedt, DE;

Assignee:

H.C. STARCK INC., Newton, MA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Colleen P Dunn

Assistant Examiner:

Nicholas A Wang

Int. Cl.
CPC ...
C23C 14/34 (2006.01); B22F 3/02 (2006.01); B22F 3/15 (2006.01); C23C 14/14 (2006.01); C22F 1/18 (2006.01); H01J 37/34 (2006.01); B22F 1/00 (2006.01); B22F 3/12 (2006.01); C22C 1/04 (2006.01); B22F 3/10 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 1/0014 (2013.01); B22F 3/02 (2013.01); B22F 3/1208 (2013.01); B22F 3/15 (2013.01); C22C 1/045 (2013.01); C22F 1/18 (2013.01); C23C 14/14 (2013.01); H01J 37/3426 (2013.01); B22F 2003/1014 (2013.01);
Abstract

A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.

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