The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
May. 19, 2014
Applicant:
Nippon Electric Glass Co., Ltd., Otsu-shi, Shiga, JP;
Inventors:
Noriaki Masuda, Otsu, JP;
Yohei Hosoda, Otsu, JP;
Shingo Nakane, Otsu, JP;
Hiroki Yamazaki, Otsu, JP;
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/40 (2006.01); C08K 7/20 (2006.01); C03C 3/078 (2006.01); C03C 3/083 (2006.01); C03C 3/085 (2006.01); C03C 3/097 (2006.01); C03C 4/00 (2006.01); C03C 10/00 (2006.01); C03C 12/00 (2006.01); C03C 3/06 (2006.01); C03C 8/24 (2006.01); C09C 1/28 (2006.01);
U.S. Cl.
CPC ...
C08K 3/40 (2013.01); C03C 3/06 (2013.01); C03C 3/085 (2013.01); C03C 3/097 (2013.01); C03C 8/24 (2013.01); C03C 10/0009 (2013.01); C03C 10/0027 (2013.01); C08K 7/20 (2013.01); C09C 1/28 (2013.01); C01P 2004/32 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C01P 2004/80 (2013.01); C01P 2006/12 (2013.01); C01P 2006/22 (2013.01); C01P 2006/32 (2013.01); C01P 2006/60 (2013.01); C03C 2201/02 (2013.01); C03C 2203/10 (2013.01);
Abstract
Provided is a filler powder that has a lower coefficient of thermal expansion than silica powder and is less likely to cause quality and color alteration of a resin when blended into the resin. The filler powder is made of a crystallized glass in which β-quartz solid solution and/or β-eucryptite is precipitated. The filler powder preferably has an average particle size Dof 5 μm or less. The filler powder preferably has a coefficient of thermal expansion of 5×10/° C. or less in a range of 30 to 150° C.