The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
May. 18, 2015
Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres having an almost spherical shape and high expansion performance and exhibiting good workability when mixed with a resin, a process for producing the heat-expandable microspheres, and applications thereof. The heat-expandable microspheres include a thermoplastic resin shell and a blowing agent encapsulated therein and vaporizable by heating. The thermoplastic resin is produced by polymerizing a polymerizable component containing a methacrylate monomer and a carboxyl-containing monomer, and optionally containing a nitrile monomer in an amount ranging from 0 to 30 parts by weight to 100 parts by weight of the total amount of the methacrylate monomer and the carboxyl-containing monomer. The blowing agent contains a hydrocarbon having at least 8 carbon atoms per molecule.