The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Aug. 26, 2014
Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventors:

Yufeng Wu, Brookfield, CT (US);

Tzer-Yi Chen, Brookfield, CT (US);

Assignee:

Illinois Tool Works Inc., Glenview, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 13/01 (2006.01); B23K 1/002 (2006.01); B41J 2/16 (2006.01); B23K 1/00 (2006.01); B41J 2/14 (2006.01); B23K 101/04 (2006.01);
U.S. Cl.
CPC ...
B41J 2/162 (2013.01); B23K 1/002 (2013.01); B23K 1/0008 (2013.01); B41J 2/14 (2013.01); B41J 2/14024 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B23K 2201/04 (2013.01);
Abstract

A method (e.g., for creating a printing plate assembly of an ink jet print head assembly) includes coating one or more sides of plural planar subsection plates with a bonding material. The subsection plates include printing holes through which a fluid is to be ejected from the ink jet print head assembly. The method also includes placing the subsection plates of the printing plate assembly against each other with the printing holes axially aligned with each other and heating the bonding material between the subsection plates such that the subsection plates are affixed to each other. The subsection plates are coupled with each other to form a chamber printing assembly that is coupled to the ink jet print head assembly that prints fluid onto one or more objects by ejecting the fluid out of the printing holes of the subsection plates. The subsection plates may be hermetically bonded to each other by inductively heating the assembly.


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