The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 14, 2017
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya-shi, Aichi-ken, JP;

Inventor:

Hirotoshi Ishizaki, Nagakute, JP;

Assignee:

BROTHER KOGYO KABUSHIKI KAISHA, Nagoya-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 29/377 (2006.01); B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/04515 (2013.01); B41J 29/377 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14459 (2013.01); B41J 2202/08 (2013.01); B41J 2202/20 (2013.01); B41J 2202/21 (2013.01);
Abstract

There is provided a head module including: a head which has an inlet, a plurality of nozzles, and a plurality of driving elements, and in which the nozzles are aligned in rows in a longitudinal direction of a nozzle surface orthogonal to a attaching/detaching direction of the head module; a plurality of driver ICs; a heat spreader; a flexible substrate; and a rigid substrate. In the attaching/detaching direction, the driver ICs are arranged between the head and the heat spreader; the rigid substrate and the head are arranged side by side in the attaching/detaching direction; the rigid substrate and the heat spreader are arranged side by side in a short direction of the nozzle surface; and the rigid substrate has a thickness along the short direction of the nozzle surface.


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