The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 14, 2016
Applicant:

Olympus Corporation, Shibuya-ku, Tokyo, JP;

Inventors:

Masaki Otsuka, Hino, JP;

Koki Iwasawa, Akiruno, JP;

Shigeya Sugata, Hachioji, JP;

Yoshitaka Otsuka, Hino, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 45/73 (2006.01); B29C 45/27 (2006.01); B29C 45/00 (2006.01); B29C 45/18 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00538 (2013.01); B29C 45/0025 (2013.01); B29C 45/18 (2013.01); B29C 45/2708 (2013.01); B29D 11/00432 (2013.01); B29C 45/0046 (2013.01); B29K 2909/08 (2013.01); B29K 2995/0015 (2013.01);
Abstract

An injection molding method includes a supply step of simultaneously supplying molten resins to a cavity portion from two gate portions and an associating step of associating the molten resins supplied from the two gate portions in a central part of the cavity portion. The supply step supplies the molten resins to the cavity portion from the two gate portions which substantially face each other around the cavity portion. The associating step includes at least one of a first step in the supply step of simultaneously starting the supply of the molten resins to the cavity portion from the two gate portions, and a second step in the supply step of simultaneously starting the injection of the molten resins into the cavity portion from the two gate portions at the same injection rate.


Find Patent Forward Citations

Otsuka, Masaki. (2018). Injection molding method and injection molding die (U.S. Patent No. 10022926). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10022926

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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