The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Feb. 08, 2013
Omron Corporation, Kyoto-shi, Kyoto, JP;
Isao Makuta, Saitama, JP;
Koichi Takemura, Saitama, JP;
Tomofusa Shibata, Saitama, JP;
Yoshihisa Yamanaka, Shiga, JP;
Norikazu Kitamura, Osaka, JP;
Masayuki Shinohara, Kyoto, JP;
Kazuhide Hirota, Shiga, JP;
Toshikaga Taguchi, Shiga, JP;
Masayuki Kojima, Saitama, JP;
Yukihiro Takahashi, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.