The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Apr. 28, 2015
Kaijo Corporation, Tokyo, JP;
Hikaru Yoshida, Tokyo, JP;
Mizuho Shiroto, Tokyo, JP;
KAIJO CORPORATION, Tokyo, JP;
Abstract
To provide a wire bonding method and a wire bonding device capable of stably forming a free air ball having a large ball diameter while suppressing oxidation of the free air ball, in addition to supply of an oxidation prevention gas from gas supply means () into an insertion portion (), an oxidation prevention gas is supplied from a gas supply nozzle (), which is arranged outside the insertion portion (), so as to cover an inlet of the insertion portion (). Under a state in which a leading end of a wire () is positioned inside the insertion portion (), and in which a leading end of a capillary () is positioned outside the insertion portion (), spark discharge is generated. With this, a free air ball () having a large ball diameter can be formed while suppressing oxidation of the free air ball () and stabilizing the free air ball ().