The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 29, 2014
Applicant:

Veeco Precision Surface Processing Llc, Horsham, PA (US);

Inventors:

William Gilbert Breingan, Media, PA (US);

James K. Anders, Southampton, PA (US);

Herman Itzkowitz, Bala Cynwyd, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B05C 11/08 (2006.01); B05C 13/00 (2006.01); B05D 1/00 (2006.01); H01L 21/687 (2006.01); B05C 1/08 (2006.01); C23C 16/458 (2006.01); C23C 14/50 (2006.01);
U.S. Cl.
CPC ...
B05C 13/00 (2013.01); H01L 21/68792 (2013.01); B05C 1/08 (2013.01); B05D 1/005 (2013.01); C23C 14/505 (2013.01); C23C 16/4585 (2013.01); C23C 16/4588 (2013.01); H01L 21/6838 (2013.01);
Abstract

A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer.


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