The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Dec. 11, 2015
Exxonmobil Research and Engineering Company, Annandale, NJ (US);
Paul Podsiadlo, Easton, PA (US);
Quanchang Li, Dayton, NJ (US);
David Charles Calabro, Bridgewater, NJ (US);
Lei Zhang, Basking Ridge, NJ (US);
Kiara M. Benitez, Budd Lake, NJ (US);
Himanshu Gupta, Lebanon, NJ (US);
Xiaochun Xu, Sugar Land, TX (US);
Scott J. Weigel, Allentown, PA (US);
Darryl Donald Lacy, Easton, PA (US);
Bal Kaul, Fairfax, VA (US);
James William Gleeson, Magnolia, TX (US);
Wenyih Frank Lai, Bridgewater, NJ (US);
Mobae Afeworki, Phillipsburg, NJ (US);
Simon Christopher Weston, Annandale, NJ (US);
David A. Griffin, Phillipsburg, NJ (US);
Meghan Nines, Lansdale, PA (US);
EXXONMOBIL RESEARCH AND ENGINEERING COMPANY, Annandale, NJ (US);
Abstract
Methods of preparing organosilica materials, which are a polymer comprising of at least one independent cyclic polyurea monomer of Formula wherein each Ris a ZOZZSiZgroup, wherein each Zrepresents a hydrogen atom, a C-Calkyl group, or a bond to a silicon atom of another monomer unit; each Zand Zindependently represent a hydroxyl group, a C-Calkyl group, a C-Calkoxy group or an oxygen atom bonded to a silicon atom of another monomer unit; and each Zrepresents a C-Calkylene group bonded to a nitrogen atom of the cyclic polyurea are provided herein. Methods of preparing and processes of using the organosilica materials, e.g., for gas separation, color removal, etc., are also provided herein.