The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Aug. 31, 2015
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Yuichi Sugiyama, Tokyo, JP;
Masashi Miyazaki, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4641 (2013.01); H01L 23/142 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H05K 1/185 (2013.01); H05K 3/429 (2013.01); H05K 3/4608 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/061 (2013.01);
Abstract
In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer.