The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Dec. 09, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yoshihito Otsubo, Nagaokakyo, JP;

Keisuke Araki, Nagaokakyo, JP;

Yuki Ito, Nagaokakyo, JP;

Kenji Kubota, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/028 (2013.01); H05K 1/0243 (2013.01); H05K 1/0313 (2013.01); H05K 1/181 (2013.01);
Abstract

A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.


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