The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Sep. 19, 2014
Applicant:

Pulse Finland Oy, Kempele, FI;

Inventors:

Esa Kalistaja, Oulu, FI;

Riku Lambacka, Oulu, FI;

Petteri Annamaa, Oulunsalo, FI;

Assignee:

PULSE FINLAND OY, Oulunsalo, FI;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 5/385 (2015.01); H01Q 1/24 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 9/42 (2006.01); H01Q 5/371 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/36 (2013.01); H01Q 1/38 (2013.01); H01Q 5/371 (2015.01); H01Q 5/385 (2015.01); H01Q 9/42 (2013.01); Y10T 29/49018 (2015.01);
Abstract

A 'thin' and cost-effective three-dimensional antenna assembly and methods of use and manufacturing thereof. In one exemplary embodiment, the solution of the present disclosure is particularly adapted for small form-factor portable radio devices, and comprises an antenna (or array of antennas) deposited on a thin preformed flexible or deformable structure using a conductive fluid. The antenna (array) includes one or more antennas each having a radiator and a plurality of contacts. Use of the thin preformed structure allows, among other things, thinner form factors for the host wireless device, and obviates use of a separate molded carrier or other more costly or involved processes (such as laser direct structuring).


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