The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Sep. 23, 2016
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Edward K. Huang, Thousand Oaks, CA (US);

Andrew D. Hood, Ventura, CA (US);

Bryan Gall, Ventura, CA (US);

Paula Heu, Santa Barbara, CA (US);

Richard E. Bornfreund, Santa Barbara, CA (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 27/1462 (2013.01); H01L 27/1465 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14685 (2013.01); H01L 27/14694 (2013.01); H01L 27/14696 (2013.01); H01L 27/14698 (2013.01); H04N 5/33 (2013.01);
Abstract

Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier wafer, releasing the device wafer from the first carrier wafer, singulating the device wafer into individual dies, each die having an infrared focal plane array, and hybridizing the individual dies to a read out integrated circuit.


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