The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Sep. 09, 2016
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Wei-Chih Chien, Zhubei, TW;

Ying-Chih Kuo, Hsinchu, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01);
Abstract

A short-resistant CSP includes an isolation layer, an electrically conductive RDL, and an insulating layer. The electrically conductive RDL is on the isolation layer and includes a first and a second RDL segment. The insulating layer includes a first insulator portion between the isolation layer and the first RDL segment to improve electrical isolation between the first and second RDL segments. A method for preventing short-circuiting between conductors of CSP includes (1) depositing a first insulating layer on a first substrate region, (2) depositing a RDL segment on the substrate above the first substrate region, at least a portion of the first insulating layer being between the first RDL segment and the first substrate region, and (3) depositing a second RDL segment on the substrate above a second substrate region, such that the first insulating layer interrupts a leakage current path between the first and second RDL segments.


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