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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10020282 B1

PDFFull Text
Date of Patent:
Jul. 10, 2018

Filed:

Apr. 24, 2013

Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig

Applicants:

Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;

Sanken Electric Co., Ltd.;

Inventors:

Satoshi Tanimoto, Yokohama, JP;

Yusuke Zushi, Tokyo, JP;

Yoshinori Murakami, Yokohama, JP;

Kohei Matsui, Hino, JP;

Shinji Sato, Niiza, JP;

Yu Fukushima, Yamanashi, JP;

Assignees:

NISSAN MOTOR CO., LTD., Yokohama-shi, JP;

SANKEN ELECTRIC CO., LTD., Niiza-shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 37/04 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 37/0426 (2013.01); H01L 24/75 (2013.01); H05K 3/34 (2013.01); H05K 13/0465 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/97 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/7532 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/75314 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75317 (2013.01); H01L 2224/75756 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83022 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83211 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1037 (2013.01); H01L 2924/1067 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3656 (2013.01); H05K 3/3431 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0278 (2013.01);
Abstract

In a heat insulating load jigof the present invention, a solder materialhaving a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chipand a temperature 100° C. below the thermal resistance temperature is interposed between a circuit boardand the semiconductor chip; a heat insulating bodyis placed on an upper side of the semiconductor chipin this state; a metal weightis disposed on the heat insulating body; and load is applied to the semiconductor chipwhile the solder materialis melted and solidified.

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