The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Jul. 06, 2015
Lg Innotek Co., Ltd., Seoul, KR;
Tae Ki Hong, Gyeongbuk, KR;
Dong Guk Jo, Gyeonggi-do, KR;
Han Mo Koo, Gyeongbuk, KR;
Jun Young Lim, Gyeongbuk, KR;
Ki Tae Park, Gyeongbuk, KR;
Sang Ki Cho, Gyeongbuk, KR;
Dae Sung Yoo, Gyeongbuk, KR;
Nak Ho Song, Gyeongbuk, KR;
Joo Chul Kim, Gyeongbuk, KR;
Jae Sung Jo, Gyeongbuk, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.