The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Jan. 31, 2017
Applicants:

Fuji Xerox Co., Ltd., Tokyo, JP;

Noda Screen Co., Ltd., Komaki-shi, Aichi, JP;

Inventors:

Daisuke Iguchi, Ebina, JP;

Atsunori Hattori, Komaki, JP;

Assignees:

FUJI XEROX CO., LTD., Minato-ku, Tokyo, JP;

NODA SCREEN CO., LTD., Komaki-shi, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/492 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 21/4875 (2013.01); H01L 23/492 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/53214 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A circuit substrate includes: a base material; and a capacitor layer. The capacitor layer includes a first metal layer that is provided on the base material, a dielectric layer that is provided on the first metal layer, and a second metal layer that is provided on the dielectric layer. The first metal layer includes a first electrode region which is provided on the base material and is exposed from the dielectric layer and to which a first terminal of a capacitor element for supplying current to a circuit part through the capacitor layer is connected. The second metal layer includes a second electrode region in which the second metal layer is exposed and to which a second terminal of the capacitor element is connected.


Find Patent Forward Citations

Iguchi, Daisuke. (2018). Circuit substrate and method for manufacturing circuit substrate (U.S. Patent No. 10020277). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10020277

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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