The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
May. 13, 2016
Lg Innotek Co., Ltd., Seoul, KR;
Dae Sung Yoo, Seoul, KR;
Han Mo Koo, Seoul, KR;
Ki Tae Park, Seoul, KR;
Jun Young Lim, Seoul, KR;
Tae Ki Hong, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.