The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Oct. 28, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Hoehn, Soest, DE;

Georg Borghoff, Warstein, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/15 (2006.01); H01L 23/053 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/4853 (2013.01); H01L 21/4885 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H05K 5/0008 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier. A semiconductor component is arranged on the circuit carrier. The power semiconductor module also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier and/or to the semiconductor component. The terminal block has a screw thread that is accessible from an outer side of the module housing. A method for producing such a power semiconductor module is also provided.


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