The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Jun. 10, 2016
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Koji Shimazawa, Tokyo, JP;
Tsutomu Chou, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01); H01L 21/225 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02675 (2013.01); H01L 21/0268 (2013.01); H01L 21/02354 (2013.01); H01L 21/268 (2013.01); H01L 21/324 (2013.01); H01L 21/2254 (2013.01);
Abstract
A laser annealing method that includes forming a second layer having through holes on a first layer, and radiating laser light with a wavelength of 3 μm or greater to the first layer via the through holes.
Shimazawa, Koji. (2018). Method for laser annealing with laser beam radiated via through hole (U.S. Patent No. 10020193). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10020193
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile