The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Sep. 28, 2015
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Katsuyoshi Endoh, Chiba, JP;

Ko Nishiwaki, Sakura, JP;

Assignee:

FUJIKURA LTD., Koto-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/20 (2006.01);
U.S. Cl.
CPC ...
H01G 9/2077 (2013.01); H01G 9/2022 (2013.01); H01G 9/2059 (2013.01); H01G 9/2004 (2013.01); H01G 9/2031 (2013.01);
Abstract

A dye-sensitized photoelectric conversion element including a cell is disclosed. The cell includes a conductive substrate and a transparent conductive layer, a counter substrate facing the conductive substrate and including a metal substrate, a semiconductor layer provided on the conductive substrate, a sealing portion bonding the conductive and the counter substrates, a connecting portion connecting one end of a wiring material and the metal substrate, and a portion to be connected which is connected to the other end of the wiring material, the connecting portion contains first conductive particles, a filler, and a binder resin, the wiring material contains second conductive particles and a binder resin, an average particle diameter of the first conductive particles is greater than that of the filler in the connecting portion, and a content rate of the filler in the connecting portion is greater than that of the filler in the wiring material.


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