The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Oct. 01, 2012
Applicant:

Katsuhiro Doi, Chiba, JP;

Inventor:

Katsuhiro Doi, Chiba, JP;

Assignee:

FUJIKURA LTD., Koto-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/12 (2006.01); H01G 9/20 (2006.01); H01M 2/08 (2006.01); H01M 10/04 (2006.01); G02F 1/1339 (2006.01);
U.S. Cl.
CPC ...
H01G 9/2077 (2013.01); G02F 1/1339 (2013.01); H01G 9/2031 (2013.01); H01G 9/2059 (2013.01); H01M 2/08 (2013.01); H01M 10/0463 (2013.01); Y02E 10/542 (2013.01);
Abstract

The present invention is an electronic device comprising a first substrate, a second substrate arranged opposite the first substrate, a sealed portion arranged between the first substrate and the second substrate, and a sealing portion that connects the first and the second substrate and is provided around the sealed portion, wherein at least a portion of the sealing portion following along the periphery of the sealed portion has outer resin sealing portions respectively fixed to the first substrate and the second substrate and an intermediate resin sealing portion arranged so as to be interposed by the outer resin sealing portions between the first substrate and the second substrate, the outer resin sealing portions and the intermediate resin sealing portion contain resin, and a melt flow rate or melting point of the intermediate resin sealing portion differs from a melt flow rate or melting point of the outer resin sealing portions.


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