The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Mar. 29, 2016
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Jun Li, Beijing, CN;
Xianlin Ding, Beijing, CN;
Guiyu Zhang, Beijing, CN;
Ting Zeng, Beijing, CN;
Jun Chen, Beijing, CN;
Qingpu Wang, Beijing, CN;
Hongqiang Luo, Beijing, CN;
Kefeng Li, Beijing, CN;
Qicheng Chen, Beijing, CN;
Zhi Du, Beijing, CN;
Zhanqi Xu, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, Anhui, CN;
Abstract
The present invention provides a touch substrate, comprising a plurality of first electrodes extending along a first direction and a plurality of second electrodes extending along a second direction intersecting with the first direction, wherein the first electrode comprises a plurality of first electrode blocks, the second electrode comprises a plurality of second electrode blocks, adjacent two first electrode blocks are connected via at least one electrically conductive connecting piece, adjacent two second electrode blocks are formed integrally; a connecting piece comprises two contact portions and a connecting portion, the insulating layer at least covers each connecting piece and exceeds border of the connecting piece, the first electrode block is electrically connected to the contact portion via a via hole passing through the insulating layer, and a part of the contact portion is not exposed by the via hole.