The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Jan. 09, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Tsuyoshi Arai, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); G03F 7/00 (2006.01); G11B 5/84 (2006.01); G11B 5/855 (2006.01); B29C 43/00 (2006.01); B41L 19/00 (2006.01); B29C 43/58 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 59/00 (2006.01); G01B 21/08 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 43/00 (2013.01); B29C 43/58 (2013.01); B29C 59/002 (2013.01); B41L 19/00 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G01B 21/08 (2013.01); G11B 5/84 (2013.01); G11B 5/855 (2013.01);
Abstract

The present invention provides an imprint apparatus which performs an imprint process of transferring a pattern onto a substrate, the apparatus comprising a deforming unit configured to deform the pattern surface by applying a force to the mold, an obtaining unit configured to obtain thickness information of the mold, a calculation unit configured to calculate a force to be applied to the mold based on the thickness information of the mold obtained by the obtaining unit, so that the pattern surface has a target shape in the imprint process, and a control unit configured to control the deforming unit to apply the force calculated by the calculation unit to the mold in the imprint process.


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