The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Sep. 21, 2015
Applicant:

University of Maryland, College Park, College Park, MD (US);

Inventors:

Reinhard K. Radermacher, Silver Spring, MD (US);

Ichiro Takeuchi, Laurel, MD (US);

Yunho Hwang, Ellicott City, MD (US);

Yiming Wu, Danbury, CT (US);

Suxin Qian, Hyattsville, MD (US);

Jiazhen Ling, Ellicott City, MD (US);

Assignee:

University of Maryland, College Park, College Park, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 17/00 (2006.01); F25B 23/00 (2006.01); C09K 5/14 (2006.01); C09K 5/10 (2006.01);
U.S. Cl.
CPC ...
F25B 23/00 (2013.01); C09K 5/10 (2013.01); C09K 5/14 (2013.01); Y02P 20/124 (2015.11);
Abstract

A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.


Find Patent Forward Citations

Loading…