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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10017870 B1

PDFFull Text
Date of Patent:
Jul. 10, 2018

Filed:

Mar. 25, 2015

Method for fabricating a heat sink, and heat sink

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Friedrich Kroener, Villach, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:

Viering, Jentschura & Partner mbB

Primary Examiner:

Edna Wong

Int. Cl.
CPC ...
C25D 5/54 (2006.01); C25D 5/02 (2006.01); B82Y 30/00 (2011.01); C25D 5/10 (2006.01); H01L 23/373 (2006.01); C25D 7/12 (2006.01); C25D 5/14 (2006.01); C25D 5/50 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); D06M 10/06 (2006.01); D06M 11/83 (2006.01); D06M 101/40 (2006.01); C25D 5/18 (2006.01); F28F 3/02 (2006.01); F28F 21/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/022 (2013.01); B82Y 30/00 (2013.01); C25D 5/10 (2013.01); C25D 5/14 (2013.01); C25D 5/50 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); D06M 10/06 (2013.01); D06M 11/83 (2013.01); F28F 21/02 (2013.01); F28F 21/085 (2013.01); H01L 21/4871 (2013.01); H01L 23/373 (2013.01); H01L 23/3733 (2013.01); H01L 24/83 (2013.01); C25D 5/18 (2013.01); D06M 2101/40 (2013.01); F28F 3/02 (2013.01); F28F 21/00 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A method for fabricating a heat sink including providing a carbon metal composite having a plurality of metal-coated carbon fibers and a plurality of openings, the openings leading from a first side of the carbon metal composite to a second side of the carbon metal composite, disposing the carbon metal composite over a semiconductor element such that the first side of the carbon metal composite faces the semiconductor element, and bonding the carbon metal composite to the semiconductor element by means of an electroplating process, wherein a metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the plurality of openings.

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