The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Aug. 10, 2005
Keiichiro Oishi, Yao, JP;
Keiichiro Oishi, Yao, JP;
MITSUBISHI SHINDOH CO., LTD., Tokyo, JP;
Abstract
Copper alloy casting contains Cu: 58-72.5 mass %; Zr: 0.0008-0.045 mass %; P: 0.01-0.25 mass %; one or more elements selected from Pb: 0.01-4 mass %, Bi: 0.01-3 mass %, Se: 0.03-1 mass %, and Te: 0.05-1.2 mass %; and Zn: a remainder, wherein [Cu]−3[P]+0.5([Pb]+[Bi]+[Se]+[Te])=60-90, [P]/[Zr]=0.5-120, and 0.05[γ]+([Pb]+[Bi]+[Se]+[Te])=0.45-4 (the content of an element 'a' is denoted as [a] mass %; the content of γ phase is denoted as [γ]% by area ratio; and an element 'a' that is not contained is denoted as [a]=0). The total content of α phase and γ phase is 85% or more, γ phase content is 25% or less by area ratio, and mean grain size in the macrostructure during melt-solidification is 250 μm or less.