The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Feb. 04, 2015
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Yoshihiro Nojima, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1409 (2013.01); C09K 3/1463 (2013.01); H01L 21/3212 (2013.01);
Abstract

A polishing composition includes crystalline metal oxide particles as abrasive grains, wherein the full width at half maximum of a peak portion having the maximum diffracted intensity in an X-ray powder diffraction pattern of the metal oxide particles is less than 1°. Thus, a polishing composition and a polishing method have high polishing speed and suppress defect generation such as a scratch and dishing, which causes to degrade reliability of a semiconductor apparatus in a polishing process of a semiconductor substrate, particularly in a chemical mechanical polishing process of a semiconductor substrate with a metal layer having tungsten, etc.; and a method produces the polishing composition.


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