The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Sep. 05, 2017
Kaneka Corporation, Osaka, JP;
Toru Yoshida, Osaka, JP;
Shintaro Miura, Osaka, JP;
Kaneka Corporation, Osaka, JP;
Abstract
Expanded polypropylene resin particles include a polypropylene resin as a base material resin, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa. The flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]<31.19×[Melting point (° C.)]−3500, wherein the melting point of the expanded polypropylene resin particles is a melting point of 141.5° C. to 150.0° C. in a second differential scanning calorimetry (DSC) curve of a second temperature increase, the second DSC curve being obtained when the expanded polypropylene resin particles are heated from 40° C. to 220° C. at a temperature increase rate of 10° C./min in a first temperature increase, then cooled from 220° C. to 40° C. at a temperature decrease rate of 10° C./min, and heated again from 40° C. to 220° C. at a temperature increase rate of 10° C./min in the second temperature increase.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile