The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

May. 05, 2014
Applicant:

Reichhold As, Sandfjord, NO;

Inventors:

Chunhong Yin, Ludwigshafen, DE;

Achim Kaffee, Osnabrueck, DE;

Michael Henningsen, Frankenthal, DE;

Joachim Zwecker, Weinheim, DE;

Lionel Gehringer, Schaffhouse-pres-Seltz, FR;

Assignee:

Reichhold AS, Sandfjord, NO;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/04 (2006.01); C08G 59/22 (2006.01); C08G 59/40 (2006.01); C08G 59/46 (2006.01); C08L 63/00 (2006.01); C08K 7/04 (2006.01); C08K 7/14 (2006.01); C08J 5/04 (2006.01); C08G 59/50 (2006.01); C08K 7/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/043 (2013.01); C08G 59/4021 (2013.01); C08G 59/5073 (2013.01); C08J 5/042 (2013.01); C08K 7/06 (2013.01); C08K 7/14 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01);
Abstract

The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The fiber-matrix-semifinished-product composition can be produced via mixing of the constituents, whereupon the composition thickens. The resultant thickened product (semisolid fiber-matrix semifinished product) features comparatively short maturing time and comparatively long available operating time. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC. Finally, the invention also relates to a screening process for identifying epoxy-resin-based compositions which are suitable for use as thermoset matrix for producing SMC.


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