The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Jun. 24, 2014
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Daisuke Nii, Fukushima, JP;
Mitsuyoshi Nishino, Fukushima, JP;
Fuminori Sato, Fukushima, JP;
Yoshihiko Nakamura, Fukushima, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/40 (2006.01); C08G 59/42 (2006.01); C08J 5/24 (2006.01); C08K 5/49 (2006.01); C08K 9/06 (2006.01); C08J 5/10 (2006.01); B32B 15/08 (2006.01); B32B 27/38 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08K 3/013 (2018.01); C08K 5/5399 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4284 (2013.01); B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/38 (2013.01); C08G 59/42 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 5/49 (2013.01); C08K 9/06 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/202 (2013.01); B32B 2307/306 (2013.01); B32B 2307/714 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08K 5/0066 (2013.01); C08K 5/5399 (2013.01);
Abstract
A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.