The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Apr. 23, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Michael Ray Tuertscher, Cincinnati, OH (US);

Mark Eugene Noe, Cincinnati, OH (US);

Glen Harold Kirby, Cincinnati, OH (US);

Sheena Kum Foster Walker, Cincinnati, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/80 (2006.01); F01D 5/28 (2006.01); C04B 35/573 (2006.01); C04B 35/14 (2006.01); C04B 41/53 (2006.01); C04B 41/85 (2006.01); F01D 5/18 (2006.01);
U.S. Cl.
CPC ...
C04B 35/806 (2013.01); C04B 35/14 (2013.01); C04B 35/573 (2013.01); C04B 41/53 (2013.01); C04B 41/85 (2013.01); F01D 5/284 (2013.01); C04B 2235/5248 (2013.01); C04B 2235/6028 (2013.01); C04B 2235/616 (2013.01); F01D 5/187 (2013.01); F05D 2230/31 (2013.01); F05D 2230/40 (2013.01); F05D 2300/131 (2013.01); F05D 2300/15 (2013.01); F05D 2300/211 (2013.01); F05D 2300/2106 (2013.01); F05D 2300/222 (2013.01); F05D 2300/2282 (2013.01); F05D 2300/6033 (2013.01); Y02T 50/672 (2013.01);
Abstract

Methods and materials for forming in-situ features in a ceramic matrix composite component are described. The method of forming a ceramic matrix composite component with cooling features, comprises forming a preform tape, laying up said preform tape to a desired shape, placing a high-temperature resistant fugitive material insert of preselected geometry in the preform tape of the desired shape, compacting the preform tape of the desired shape, burning out the preform tape of the desired shape, melt infiltrating the desired shape, removing the high-temperature resistant insert to form the cooling features during one of the burning out or the melt infiltrating or following the burning out or the melt infiltrating.


Find Patent Forward Citations

Loading…