The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Aug. 14, 2017
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Jan-Peter Stadler, Pfullingen, DE;
Jochen Reinmuth, Reutlingen, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81C 1/00 (2006.01); B81B 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00047 (2013.01); B81B 1/004 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81C 2201/0116 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0143 (2013.01); B81C 2201/0198 (2013.01);
Abstract
A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.