The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Mar. 07, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

James Joseph Galu, Jr., Richardson, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A44B 18/00 (2006.01);
U.S. Cl.
CPC ...
A44B 18/008 (2013.01); A44B 18/0073 (2013.01); A44B 18/0096 (2013.01); Y10T 24/2767 (2015.01); Y10T 29/49826 (2015.01);
Abstract

A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are positioned, sized and shaped to fit within the loops. The moveable features include or are mechanically coupled to a material which responds to application of an actuating condition including electrical current, temperature, or an electromagnetic field by changing between the actuated state and the non-actuated state. Electrical current, temperature, or an electromagnetic field is automatically applied or changed to trigger a state change between the actuated state and non-actuated state that results in a bonding event or a debonding event between the first object and the second object.


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